Product novelty 15. July 2025

Why ENTEK?
Copper is an ideal material for electronic components. Copper is characterized by high conductivity and
good formability. Particularly pure copper is often used as a base material for the high current connections.
Since copper reacts with oxygen and other elements from the atmosphere, usually the contact resistance
of the copper surface changes during storage.
Our ENTEK coating signifi cantly increases the shelf life of copper parts and keeps the contact resistance of
the copper surface constant until further process steps.
With ETEK, expensive selective coatings for busbars or high-current contacts can be eliminated.
ENTEK forms an extremely thin organic layer on the copper that serves as a temporary tarnish protection
for the surface. Due to the extremely thin layer thickness of only a few nanometers, ENTEK does not have
any impact on further processing.

ENTEK tarnish protection for copper
» Protects copper surfaces against tarnishing
» Improvement of corrosion resistivity
» No significant change of contact resisistivity
» No influence on color and brightness
» No influence on further processing
Tarnish protection systems provide temporary protection of the copper surface and are sensitive to environmental conditions, which could weakens the protective eff ect. Therefore, copper surfaces treated with
ENTEK shows limited lifetime regarding anti tarnishing and should be stored in good conditions.

Testing of tarnish protection
The effi ciency of the protection is tested by immersion in silver nitrate or by potentiometric determination
of oxidizability.